[Beowulf] re: power prediction and planning
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Mark Hahn hahn at mcmaster.caMon Oct 5 00:14:42 PDT 2009
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in reference to recent mention of TDP and power planning, what do you think the trend in the next few years will be? 5 years ago, people were talking about exponential increases in power and power density - afaikt with straight faces. that clearly didn't happen. in fact, dissipation has clearly gone down (on a per-node basis - power per flop has gone through the floor!). I'm looking at current nodes and seeing substantial benefits to improvements in cpu power, lower voltage/power ram, more sensible chipsets, more efficient power supplies. we have a lot of nodes bought ~4 years ago - dual-socket HP DL145G2's. cpu power was around 100W/socket, and I suspect PSUs were probably ~80% efficient. now it would be hard to miss 92-93% efficient PSUs and CPUs in the 60-80W range. I'd be surprised if support chips haven't improved as well. I know even disks are dissipating a lot less, even though they never were a large component. I've even seen some vendors brag about how their fans are more efficient (which resonates with me because when a DL145G2 gets warm, the ten (10) fans ramp up dissipate noticably more power, which doesn't help the room temperature at all...) I'm also not really talking about heat density - I generally assume that we'll get an average of 2 nodes per 1U - ~80/rack. Intel seems to be agressively pushing fab tech as well - .32 nm is due this year, and they claim significant speed/power advances. SO: do you expect pretty much constant per-node dissipation? if higher, why? if lower, savings due to what? we've planned with 300W/node for a long time, but current nodes are noticably cooler than that. I imagine next-gen nodes will be lower power, not higher, unless something else changes (4 socket becomes common, or every node needs a Fermi or Larrabee card...) also, does anyone have thoughts about machineroom features that would support multiple generations, preferably without a lot of reno? for instance, we have mostly L6-30 power, which seems reasonably safe for commodity systems. but how about rack-back water cooling systems? what are the chances of getting multiple generations out of that (at least the heat-rejection part, if not the pipes or server-side heat-exchangers.) is anyone working on commodity-ish systems with water/coolant going to each node? (that is, skip or minimize the use of air) thanks, mark hahn.
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