[Beowulf] /. Cooler room or cooler servers?
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Joshua Halpern jhalpern at howard.eduFri Apr 8 07:47:08 PDT 2005
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Jim Lux wrote: > > At 04:27 PM 4/7/2005, Mark Hahn wrote: > This what I would imagine off hand... Comparable computational power of > a given IC fabrication technology (feature size/voltage/etc) will > dissipate similar amounts of power. And this is what you said you measured. Shifting away from silicon to large bandgap semiconductors could be a way out. In principle such devices could operate at much higher temperatures. The development push is coming from operation in hostile environments, such as car engines and stand alone operations where cooling is not available. http://www.geek.com/news/geeknews/2004Aug/bch20040827026691.htm At this point I would guess that the best material would be silicon carbide rather than gallium nitride. This is all pie in the sky right now but there are no first principle obstacles just money and time. Joshua Halpern
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